CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE STRUCTURE FORMED BY STACKING THE SAME

A chip package unit, a method of manufacturing the same, and package structure formed by stacking the same are provided. At least one first connecting pad, at least one second connecting pad, and at least one third connecting pad of a flexible printed circuit (FPC) board in the chip package unit are...

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Bibliographic Details
Main Authors LIN, CHUN-JUNG, GU, RUEI-TING, YU, HONGI
Format Patent
LanguageEnglish
Published 25.01.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A chip package unit, a method of manufacturing the same, and package structure formed by stacking the same are provided. At least one first connecting pad, at least one second connecting pad, and at least one third connecting pad of a flexible printed circuit (FPC) board in the chip package unit are electrically connected with one another by circuit of the FPC board. At least one die pad disposed on a front surface of a chip is electrically connected with the first connecting pad first and then electrically connected with the outside by the second connecting pad or the third connecting pad.Thereby the chip of the chip package unit can be electrically connected with the outside by the front surface or a back surface thereof. Therefore, not only production is reduced due to simplified production process and energy saved, volume of the package structure is also reduced.
Bibliography:Application Number: US202318220272