TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE

In a general aspect, an electronic device assembly includes a circuit including at least one semiconductor die, and a molded body encapsulating the circuit. The molded body has a primary surface arranged in a plane and a side surface that is non-parallel with the plane. The assembly also includes a...

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Bibliographic Details
Main Authors TEYSSEYRE, Jerome, JEON, Oseob, IM, Seungwon, CHEW, Chee Hiong
Format Patent
LanguageEnglish
Published 25.01.2024
Subjects
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
SEMICONDUCTOR DEVICES
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Summary:In a general aspect, an electronic device assembly includes a circuit including at least one semiconductor die, and a molded body encapsulating the circuit. The molded body has a primary surface arranged in a plane and a side surface that is non-parallel with the plane. The assembly also includes a slot defined in the primary surface of the molded body, and a signal lead extending out of the side surface of the molded body. The signal lead is electrically coupled with the circuit and has a plurality of bends that include a bend of that is at least partially disposed in the slot.
Bibliography:Application Number: US202318345308