STEAM DISTRIBUTION DEVICE AND METHOD RELATING TO SAME

• Main Authors: RANK, Rolf, HEIMKE, Bruno, KARN, Christian
• Format: Patent
• Language: English
• Published: 25.01.2024
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Disclosed herein are devices, systems, and methods for gas distribution in a coating process. The system may determine information representing a spatial distribution of a material vapor flow emitted from a plurality of emission nozzles. The system may control a regulator configured to affect, based on the information, a gas flow superposed on the material vapor flower. In this manner, it may be easier to counteract disturbances in the spatial distribution with which the material vapor flow exits from the plurality of emission nozzles, disturbances due to, for example, variations in the characteristics of the emission nozzles, flow-related variations in the tube, finite tube length, and the like.