APPARATUS INCLUDING AN ISOLATION ASSEMBLY

• Main Authors: SubramanyamNasum, Sreeram, Khanolkar, Vijaylaxmi, Singh, Tarunvir
• Format: Patent
• Language: English
• Published: 18.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Described examples include an apparatus including a package substrate having a die attach pad and a first semiconductor die on the die attach pad, the first semiconductor die including a transmitter. The apparatus also includes an assembly having a first plate coupled to the transmitter, a second pl...