APPARATUS INCLUDING AN ISOLATION ASSEMBLY
Described examples include an apparatus including a package substrate having a die attach pad and a first semiconductor die on the die attach pad, the first semiconductor die including a transmitter. The apparatus also includes an assembly having a first plate coupled to the transmitter, a second pl...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
18.01.2024
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | Described examples include an apparatus including a package substrate having a die attach pad and a first semiconductor die on the die attach pad, the first semiconductor die including a transmitter. The apparatus also includes an assembly having a first plate coupled to the transmitter, a second plate separated from the first plate by a dielectric and a second semiconductor die on the die attach pad, the second semiconductor die including a receiver coupled to the second plate. |
---|---|
Bibliography: | Application Number: US202318363536 |