DISAGGREGATION OF SYSTEM-ON-CHIP (SOC) ARCHITECTURE
Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon ch...
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Main Authors | , , , , , , , , , , , |
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Format | Patent |
Language | English |
Published |
11.01.2024
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Subjects | |
Online Access | Get full text |
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Summary: | Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device. |
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Bibliography: | Application Number: US202318470652 |