STRETCHABLE SUBSTRATE, AND METHOD FOR MANUFACTURING STRETCHABLE SUBSTRATE

A stretchable substrate and a manufacturing method of the stretchable substrate are disclosed. In a step of manufacturing a flexible substrate, a circuit pattern composed of one or more mounting pad parts configured to cause electronic parts to be mounted to a polyimide film PI having a fixed size i...

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Bibliographic Details
Main Authors KIM, Eunbee, SA, Gi Dong, KIM, Ja Yeon, KIM, Sa Ung, JEONG, Ji Ho
Format Patent
LanguageEnglish
Published 04.01.2024
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A stretchable substrate and a manufacturing method of the stretchable substrate are disclosed. In a step of manufacturing a flexible substrate, a circuit pattern composed of one or more mounting pad parts configured to cause electronic parts to be mounted to a polyimide film PI having a fixed size is formed, and a wiring pattern configured to circuit-connect the mounting pad parts is formed, and further an outer circumferential line of the circuit pattern is realized in a cutting line for cutting. In a step of mounting parts, the electronic parts are mounted on the circuit pattern of the flexible substrate. In a punching step for cutting the cutting line, a punching jig set to be aligned to the cutting line of the flexible substrate on which the parts are mounted is utilized, thereby realizing the excellent tensile performance of wiring configured to connect a circuit.
Bibliography:Application Number: US202018248257