MICROELECTRONIC ASSEMBLIES INCLUDING STACKED DIES COUPLED BY A THROUGH DIELECTRIC VIA

Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. In some embodiments, a microelectronic assembly may include a plurality of dies stacked vertically; a trench of dielectric material extending through the plurality of dies; a conductive via extending through...

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Bibliographic Details
Main Authors Majhi, Prashant, Mahajan, Ravindranath Vithal, Morein, Stephen
Format Patent
LanguageEnglish
Published 04.01.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. In some embodiments, a microelectronic assembly may include a plurality of dies stacked vertically; a trench of dielectric material extending through the plurality of dies; a conductive via extending through the trench of dielectric material; and a plurality of conductive pathways between the plurality of dies and the conductive via, wherein individual ones of the conductive pathways are electrically coupled to the conductive via and to individual ones of the plurality of dies, and wherein the individual ones of the plurality of conductive pathways have a first portion including a first material and a second portion including a second material different from the first material.
Bibliography:Application Number: US202217854613