HYBRID BONDING WITH PHOTONIC INTEGRATED CIRCUITS FOR HIGH BANDWIDTH RETICLE STITCHING OF RETICLE SIZED INTEGRATED CIRCUIT DIES

• Main Authors: Suthram, Sagar, Liljeberg, Thomas, Ghani, Tahir, Heck, John, Mallik, Debendra, Sharma, Abhishek A, Mahajan, Ravindranath Vithal, Gomes, Wilfred, Ranade, Pushkar Sharad
• Format: Patent
• Language: English
• Published: 04.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES

Embodiments of a microelectronic assembly comprise: a plurality of microelectronic sub-assemblies arranged in an array; and a plurality of photonic integrated circuit (PIC) dies, each PIC die having waveguides. Adjacent microelectronic sub-assemblies are coupled to one of the PIC dies by interconnects such that any one PIC die is coupled to more than two adjacent microelectronic sub-assemblies, and the microelectronic sub-assemblies coupled to each PIC die in the plurality of PIC dies are communicatively coupled by the waveguides in the PIC die. Each microelectronic sub-assembly comprises: an interposer integrated circuit (IC) die comprising one or more electrical controller circuit proximate to at least one edge of the interposer IC die; a first plurality of IC dies coupled to a first surface of the interposer IC die; and a second plurality of IC dies coupled to an opposing second surface of the interposer IC die.