ANALYSIS OF MATERIAL LAYERS ON SURFACES, AND RELATED SYSTEMS AND METHODS

A method of analyzing film on a substrate comprises receiving surface profile data obtained from measurements of a substrate having a plurality of discrete regions with one or more film layers; extracting, based on a predetermined pattern of the discrete regions, a plurality of parameters from the r...

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Bibliographic Details
Main Authors Chun, Doris Pik-Yiu, Parker, Ian David
Format Patent
LanguageEnglish
Published 28.12.2023
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRICITY
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
PHYSICS
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Summary:A method of analyzing film on a substrate comprises receiving surface profile data obtained from measurements of a substrate having a plurality of discrete regions with one or more film layers; extracting, based on a predetermined pattern of the discrete regions, a plurality of parameters from the received surface profile data, the plurality of parameters comprising one or more parameters of a film layer of each discrete regions, and displaying a user interface. The user interface may comprise a plurality of individual graphs each illustrating the one or more parameters of the one or more film layers for a corresponding subset of the plurality of discrete regions, and a composite graph illustrating the one or more parameters of the one or more film layers for each discrete region of the plurality of discrete regions, wherein the composite graph corresponds to the plurality of individual graphs being overlaid together.
Bibliography:Application Number: US202318466174