PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS

Embodiments of a microelectronic assembly comprise a microelectronic assembly, comprising: a package substrate; an interposer coupled to the package substrate, the interposer comprising a dielectric material, a conductive pillar) through the dielectric material and a conductive structure at least pa...

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Bibliographic Details
Main Authors May, Robert Alan, Tanaka, Hiroki, Darmawikarta, Kristof Kuwawi, Pietambaram, Srinivas V, Boyapati, Sri Ranga Sai
Format Patent
LanguageEnglish
Published 28.12.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Embodiments of a microelectronic assembly comprise a microelectronic assembly, comprising: a package substrate; an interposer coupled to the package substrate, the interposer comprising a dielectric material, a conductive pillar) through the dielectric material and a conductive structure at least partially surrounding the conductive pillar, the conductive structure separated from the conductive pillar by the dielectric material; and an integrated circuit (IC) die coupled to the interposer on a side opposite to the package substrate. The conductive pillar conductively couples the IC die to the package substrate, and the conductive structure is coupled to a ground connection.
Bibliography:Application Number: US202217847434