SEMICONDUCTOR MODULE

A semiconductor module includes: a mounting substrate including a mounting surface; a semiconductor element disposed on the mounting surface; a housing for the semiconductor element; a lid fixed to the housing and facing the mounting surface; an insulating sealing material disposed in a space inside...

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Bibliographic Details
Main Author MOROZUMI, Akira
Format Patent
LanguageEnglish
Published 28.12.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor module includes: a mounting substrate including a mounting surface; a semiconductor element disposed on the mounting surface; a housing for the semiconductor element; a lid fixed to the housing and facing the mounting surface; an insulating sealing material disposed in a space inside the housing and sealing the semiconductor element; and a first adsorbent disposed between the lid and the insulating sealing material and is swollen by adsorption.
Bibliography:Application Number: US202318323157