METHOD OF FORMING A PHOTORESIST UNDERLAYER AND STRUCTURE INCLUDING SAME

Methods of forming structures including a photoresist underlayer and structures including the photoresist underlayer are disclosed. Exemplary methods include forming the photoresist underlayer that includes metal. Techniques for treating a surface of the photoresist underlayer and/or depositing an a...

Full description

Saved in:
Bibliographic Details
Main Authors Sippola, Perttu, Liu, Zecheng, Piumi, Daniele, Zyulkov, Ivan, Givens, Michael Eugene, Kim, Bokheon, Ivanova, Tatiana, de Roest, David Kurt, Tomczak, Yoann
Format Patent
LanguageEnglish
Published 28.12.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Methods of forming structures including a photoresist underlayer and structures including the photoresist underlayer are disclosed. Exemplary methods include forming the photoresist underlayer that includes metal. Techniques for treating a surface of the photoresist underlayer and/or depositing an additional layer overlying the photoresist underlayer are also disclosed.
Bibliography:Application Number: US202318236051