SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

A semiconductor device includes: a plurality of word line pad portions that are stacked over a lower structure in a direction perpendicular to a surface of the lower structure; horizontal-level dielectric layers between the word line pad portions; and bridge prevention layers disposed between the wo...

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Bibliographic Details
Main Author KIM, Seung Hwan
Format Patent
LanguageEnglish
Published 21.12.2023
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Summary:A semiconductor device includes: a plurality of word line pad portions that are stacked over a lower structure in a direction perpendicular to a surface of the lower structure; horizontal-level dielectric layers between the word line pad portions; and bridge prevention layers disposed between the word line pad portions and covering ends of the horizontal-level dielectric layers.
Bibliography:Application Number: US202217989125