METHOD OF DETERMINING MARK STRUCTURE FOR OVERLAY FINGERPRINTS

An apparatus and a method for generating a metrology mark structure that can be formed on a substrate for measuring overlay characteristics induced by one or more processes performed on the substrate by determining features for the metrology mark structure based on a pattern distribution. The method...

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Bibliographic Details
Main Authors ZHANG, Huaichen, TABERY, Cyrus Emil
Format Patent
LanguageEnglish
Published 21.12.2023
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:An apparatus and a method for generating a metrology mark structure that can be formed on a substrate for measuring overlay characteristics induced by one or more processes performed on the substrate by determining features for the metrology mark structure based on a pattern distribution. The method involves obtaining a function to characterize an overlay fingerprint induced by a process performed on a substrate. Based on the function, a pattern distribution is derived, the pattern distribution being indicative of a number of features (e.g., indicative of density) within a portion of the substrate. Based on the pattern distribution, a physical characteristic (e.g., shape, size, etc.) of the features of the metrology mark structure is determined.
Bibliography:Application Number: US202118035286