INTERCONNECT STRUCTURE HAVING DIFFERENT DIMENSIONS FOR CONNECTED CIRCUIT BLOCKS IN INTEGRATED CIRCUIT

A interconnect structure for an integrated circuit may include: a metal line including a plurality of sections having different thicknesses along a 1st direction; and a plurality of vias respectively protruding from the plurality of sections of the metal line.

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Bibliographic Details
Main Authors Seo, Kang-ill, Park, Hyoeun, KIM, Eun Sung
Format Patent
LanguageEnglish
Published 14.12.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A interconnect structure for an integrated circuit may include: a metal line including a plurality of sections having different thicknesses along a 1st direction; and a plurality of vias respectively protruding from the plurality of sections of the metal line.
Bibliography:Application Number: US202217849345