COMPUTING SYSTEM WITH COOLING FOR CONTROLLING TEMPERATURE OF ELECTRONIC COMPONENTS

• Main Authors: SHEN, Fenghua, VADAKKANMARU VEEDU, Unnikrishnan, SOTO DE LA TORRE, Silvia Anali, LYAKHOV, Alexander, TADEPALLI, Madhavi, BHARATH, Krishna
• Format: Patent
• Language: English
• Published: 07.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

Technology is disclosed for a computing system with a printed circuit board having a top and bottom; an integrated circuit component coupled to the top of the board; a passive heat exchanger coupled to the top of the board and spaced from the integrated circuit component; at least one electronic component coupled to the printed circuit board below the top of the printed circuit board; and at least one heat pipe having an evaporator end adjacent the electronic component and extending away from the evaporator end along the bottom of the board to a condenser end above the top of the board, the condenser end being thermally coupled to the passive heat exchanger on the top of the board; wherein heat from electronic component is moved away from the electronic component and the integrated circuit component to the passive heat exchanger.