Anchor Structures And Methods For Uniform Wafer Planarization And Bonding

The present disclosure is directed to anchor structures and methods for forming anchor structures such that planarization and wafer bonding can be uniform. Anchor structures can include anchor layers formed on a dielectric layer surface and anchor pads formed in the anchor layer and on the dielectri...

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Bibliographic Details
Main Authors Lin, Yen-Liang, Li, Cheng-Yuan, Lee, Kuo-Cheng, Wei, Chia-Yu, Huang, Hsun-Ying, Chen, Hsin-Chi
Format Patent
LanguageEnglish
Published 30.11.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present disclosure is directed to anchor structures and methods for forming anchor structures such that planarization and wafer bonding can be uniform. Anchor structures can include anchor layers formed on a dielectric layer surface and anchor pads formed in the anchor layer and on the dielectric layer surface. The anchor layer material can be selected such that the planarization selectivity of the anchor layer, anchor pads, and the interconnection material can be substantially the same as one another. Anchor pads can provide uniform density of structures that have the same or similar material.
Bibliography:Application Number: US202318232751