3D FAN-OUT PACKAGING STRUCTURE OF INTERCONNECTION SYSTEM WITH ULTRA-HIGH DENSITY AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: Chen, Yenheng, Lin, Chengchung
• Format: Patent
• Language: English
• Published: 30.11.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A 3D fan-out packaging structure of an interconnection system with ultra-high density and a method for manufacturing the same are disclosed; the packaging structure includes a first insulating layer, first metal solder pads, a metal pillar, a first chip, a second insulating layer, second metal solder pads, a first encapsulating layer, a first rewiring layer, a second chip, a second encapsulating layer, a second rewiring layer, and a solder ball. The packaging structure adopts the "RDL first" process, and non-soldering interfaces between the first and second metal solder pads help achieve bonding with a spacing of 5-10 μm or even less, much smaller than conventional soldering spacings, thus increasing the number of available I/O ports and obtaining a high-density, highly integrated packaging structure. In addition, in the present disclosure, various chips and electronic components can be integrated together, thereby achieving high-performance system-level packaging with higher flexibility and compatibility.