BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

Disclosed are integrated circuit structures with interconnects of small size, also referred to micro-bumps. As pitches of micro-bumps become smaller, their sizes also become small. This makes it difficult to probe the integrated circuit structure to verify their operations. To enable probing, test p...

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Bibliographic Details
Main Authors CASSIER, Amer Christophe Gaetan, ZHAO, Lily, SUN, Yangyang, HE, Dongming, SONG, Stanley Seungchul
Format Patent
LanguageEnglish
Published 30.11.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:Disclosed are integrated circuit structures with interconnects of small size, also referred to micro-bumps. As pitches of micro-bumps become smaller, their sizes also become small. This makes it difficult to probe the integrated circuit structure to verify their operations. To enable probing, test pads of larger pitches are provided. The test pads, usually formed of metal, may be protected with solder caps.
Bibliography:Application Number: US202217804658