MICROCUT PATTERNED TRANSFER ARTICLES

A transfer article includes a carrier layer releasable at a release value of from 2 to 50 grams/inch from a release layer including a metal layer or a doped semiconductor layer. A functional layer overlies the carrier layer, and the functional layer includes at least one microcut inorganic layer. Th...

Full description

Saved in:
Bibliographic Details
Main Authors Johnston, Raymond P, Messina, Matthew C, Clarke, Graham M, Sullivan, John J, Gotrik, Kevin W, Jones, Scott J
Format Patent
LanguageEnglish
Published 30.11.2023
Subjects
DECORATIVE ARTS
MOSAICS
PAPERHANGING
PERFORMING OPERATIONS
PRODUCING DECORATIVE EFFECTS
SPECIAL DESIGNS OR PICTURES
TARSIA WORK
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:A transfer article includes a carrier layer releasable at a release value of from 2 to 50 grams/inch from a release layer including a metal layer or a doped semiconductor layer. A functional layer overlies the carrier layer, and the functional layer includes at least one microcut inorganic layer. The microcut inorganic layer includes a pattern of cut toolmarks and plates bounded by the toolmarks, wherein each of the plates has a thickness of about 3 nanometers to about 2000 nanometers. The transfer article has a thickness of less than 3 micrometers.
Bibliography:Application Number: US202118033429