ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION STRUCTURE

According to various embodiments, an electronic device includes: a housing; a support member which is disposed in the inner space of the housing, and which includes a first surface oriented in a first direction and a second surface oriented in a second direction that is opposite to the first surface...

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Bibliographic Details
Main Authors Park, Sungyong, LEE, Yongseok, Moon, Heecheul
Format Patent
LanguageEnglish
Published 23.11.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:According to various embodiments, an electronic device includes: a housing; a support member which is disposed in the inner space of the housing, and which includes a first surface oriented in a first direction and a second surface oriented in a second direction that is opposite to the first surface; at least one pattern formed to have a length in a designated direction in at least a part of the first surface and/or the second surface of the support member; and a heat dissipation coating layer stacked on the first surface and/or the second surface on which the at least one pattern is formed, wherein the at least one pattern may include a plurality of recesses spaced apart from each other at designated intervals and formed on the first surface and/or the second surface.
Bibliography:Application Number: US202318230517