Dummy through vias for Integrated Circuit Packages and Methods of Forming the Same

In an embodiment, a device includes: an integrated circuit die including a die connector; a first through via adjacent the integrated circuit die; an encapsulant encapsulating the first through via and the integrated circuit die; and a redistribution structure on the encapsulant, the redistribution...

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Main Authors Li, Chien-Chen, Liu, Kuo-Chio, Kuo, Chien-Li, Lin, Wen-Yi, Lee, Kuang-Chun
Format Patent
LanguageEnglish
Published 23.11.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract In an embodiment, a device includes: an integrated circuit die including a die connector; a first through via adjacent the integrated circuit die; an encapsulant encapsulating the first through via and the integrated circuit die; and a redistribution structure on the encapsulant, the redistribution structure including a redistribution line, the redistribution line physically and electrically coupled to the die connector of the integrated circuit die, the redistribution line electrically isolated from the first through via, the redistribution line crossing over the first through via.
AbstractList In an embodiment, a device includes: an integrated circuit die including a die connector; a first through via adjacent the integrated circuit die; an encapsulant encapsulating the first through via and the integrated circuit die; and a redistribution structure on the encapsulant, the redistribution structure including a redistribution line, the redistribution line physically and electrically coupled to the die connector of the integrated circuit die, the redistribution line electrically isolated from the first through via, the redistribution line crossing over the first through via.
Author Liu, Kuo-Chio
Li, Chien-Chen
Lee, Kuang-Chun
Kuo, Chien-Li
Lin, Wen-Yi
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Snippet In an embodiment, a device includes: an integrated circuit die including a die connector; a first through via adjacent the integrated circuit die; an...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Dummy through vias for Integrated Circuit Packages and Methods of Forming the Same
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