Dummy through vias for Integrated Circuit Packages and Methods of Forming the Same

• Main Authors: Li, Chien-Chen, Liu, Kuo-Chio, Kuo, Chien-Li, Lin, Wen-Yi, Lee, Kuang-Chun
• Format: Patent
• Language: English
• Published: 23.11.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

In an embodiment, a device includes: an integrated circuit die including a die connector; a first through via adjacent the integrated circuit die; an encapsulant encapsulating the first through via and the integrated circuit die; and a redistribution structure on the encapsulant, the redistribution structure including a redistribution line, the redistribution line physically and electrically coupled to the die connector of the integrated circuit die, the redistribution line electrically isolated from the first through via, the redistribution line crossing over the first through via.