DEVICE FOR MEASURING PHYSICAL PROPERTY OF WAFER

A device is provided. The device is arranged in a wafer box and is configured to simulate to measure physical properties of a surface of a wafer in the wafer box during an air filling and exchanging operation on the wafer box when the wafer box is closed. The device includes one or more simulating m...

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Bibliographic Details
Main Authors CHEN, CHUNUNG, WEN, SI-YU, HUANG, CHUN-KAI
Format Patent
LanguageEnglish
Published 23.11.2023
Subjects
MEASURING
MEASURING QUANTITY OF HEAT
MEASURING TEMPERATURE
PHYSICS
TESTING
THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Summary:A device is provided. The device is arranged in a wafer box and is configured to simulate to measure physical properties of a surface of a wafer in the wafer box during an air filling and exchanging operation on the wafer box when the wafer box is closed. The device includes one or more simulating members and one or more sensors. Each simulating members is arranged in one receiving groove. The physical properties of a surface of each simulating member received in the one receiving groove matches with the physical properties of the surface of the wafer received in the one receiving groove. At least one of the one or more sensors is arranged on a corresponding simulating member, each sensor is configured to measure the physical properties of a surface of a corresponding simulating member. A related wafer box is also provided.
Bibliography:Application Number: US202318199858