MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE

The present disclosure relates to the technical field of semiconductors, and provides a manufacturing method of a semiconductor structure and a semiconductor structure. The substrate comprises an active region, and the active region is provided with a source region of a first doping type and a drain...

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Bibliographic Details
Main Author LV, Zhaohong
Format Patent
LanguageEnglish
Published 09.11.2023
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Summary:The present disclosure relates to the technical field of semiconductors, and provides a manufacturing method of a semiconductor structure and a semiconductor structure. The substrate comprises an active region, and the active region is provided with a source region of a first doping type and a drain region of the first doping type; the first dielectric layer is at least partially provided on the substrate and covers a part of the source region and/or a part of the drain region; the second dielectric layer is provided on the substrate, the first dielectric layer is connected to the second dielectric layer, and a thickness of the second dielectric layer is less than a thickness of the first dielectric layer; orthographic projection of the gate structure on the substrate covers orthographic projection of the second dielectric layer and orthographic projection of the first dielectric layer on the substrate.
Bibliography:Application Number: US202217935616