SCALABLE PACKAGE ARCHITECTURE USING RETICLE STITCHING AND PHOTONICS FOR ZETTA-SCALE INTEGRATED CIRCUITS

Embodiments of a microelectronic assembly comprise a first integrated circuit (IC) die including a plurality of first circuits separated by scribe regions, and a plurality of second IC dies coupled to the first IC die, each one of the second IC dies being coupled proximate and adjacent to a correspo...

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Bibliographic Details
Main Authors Kokar, Altug, Damaraju, Satish, Siers, Scott E, Gomes, Wilfred, Davis, Mark C
Format Patent
LanguageEnglish
Published 02.11.2023
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Summary:Embodiments of a microelectronic assembly comprise a first integrated circuit (IC) die including a plurality of first circuits separated by scribe regions, and a plurality of second IC dies coupled to the first IC die, each one of the second IC dies being coupled proximate and adjacent to a corresponding one of the first circuits and conductively coupled to the corresponding one of the first circuits. One or more of the second IC dies comprises a second circuit different from the first circuit, adjacent ones of the first circuits are coupled by a conductive pathway through the corresponding scribe regions, and the first IC die and the second IC die are coupled by interconnects having a pitch not more than 10 micrometers between adjacent interconnects.
Bibliography:Application Number: US202217733880