Dummy Metal-Insulator-Metal Structures Within Vias

• Main Authors: Hsiao, Yuan-Yang, Shen, Hsiang-Ku
• Format: Patent
• Language: English
• Published: 02.11.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Via array configurations for metal-insulator-metal (MIM) capacitor structures are disclosed herein. An exemplary MIM capacitor structure includes a capacitor bottom metal layer, a first dielectric layer over the capacitor bottom metal layer, a capacitor middle metal layer over the first dielectric layer, a second dielectric layer over the capacitor middle metal layer, and a capacitor top metal layer over the second dielectric layer. A metal via array, which has a first metal via and a second metal via, is connected to the capacitor top metal layer and the capacitor bottom metal layer. A portion of the capacitor top metal layer covers an area of the second dielectric layer extending from the first metal via to the second metal via. From a top view, the portion of the capacitor top metal layer surrounds the first metal via and the second metal via.