METHOD AND APPARATUS FOR FORMING A PATTERNED LAYER OF MATERIAL

Methods and apparatus for forming a patterned layer of material are disclosed. In one arrangement, a deposition-process material is provided in gaseous form. A layer of the deposition-process material is formed on the substrate by causing condensation or deposition of the gaseous deposition-process...

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Bibliographic Details
Main Authors DRUZHININA, Tamara, COENEN, Teis Johan, LUGIER, Olivier Christian Maurice, OVERKAMP, Jim Vincent, DE VRIES, Gosse Charles, KURGANOVA, Evgenia, POLYAKOV, Alexey Olegovich, CASTELLANOS ORTEGA, Sonia
Format Patent
LanguageEnglish
Published 02.11.2023
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:Methods and apparatus for forming a patterned layer of material are disclosed. In one arrangement, a deposition-process material is provided in gaseous form. A layer of the deposition-process material is formed on the substrate by causing condensation or deposition of the gaseous deposition-process material. A selected portion of the layer of deposition-process material is irradiated to modify the deposition-process material in the selected portion.
Bibliography:Application Number: US202117800649