PRINTED CIRCUIT BOARD ASSEMBLY WITH INTEGRATED VAPOR CHAMBER

A printed circuit board assembly comprises: a printed circuit board (PCB); an integrated circuit (IC) package that is mounted on the PCB and includes a first surface and a bare IC die disposed on the first surface; and a vapor chamber coupled to the first surface of the IC package.

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Bibliographic Details
Main Authors FIELDS, JR., James Stephen, PARK, Seungkug, HALEY, David
Format Patent
LanguageEnglish
Published 26.10.2023
Subjects
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Summary:A printed circuit board assembly comprises: a printed circuit board (PCB); an integrated circuit (IC) package that is mounted on the PCB and includes a first surface and a bare IC die disposed on the first surface; and a vapor chamber coupled to the first surface of the IC package.
Bibliography:Application Number: US202217728731