PRINTED CIRCUIT BOARD ASSEMBLY WITH INTEGRATED VAPOR CHAMBER
A printed circuit board assembly comprises: a printed circuit board (PCB); an integrated circuit (IC) package that is mounted on the PCB and includes a first surface and a bare IC die disposed on the first surface; and a vapor chamber coupled to the first surface of the IC package.
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
26.10.2023
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Subjects | |
Online Access | Get full text |
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Summary: | A printed circuit board assembly comprises: a printed circuit board (PCB); an integrated circuit (IC) package that is mounted on the PCB and includes a first surface and a bare IC die disposed on the first surface; and a vapor chamber coupled to the first surface of the IC package. |
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Bibliography: | Application Number: US202217728731 |