MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM)

Embodiments may relate to a microelectronic package that includes a die coupled with a package substrate. A plurality of solder thermal interface material (STIM) thermal interconnects may be coupled with the die and an integrated heat spreader (IHS) may be coupled with the plurality of STIM thermal...

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Bibliographic Details
Main Authors Yao, Jimin, Chan Arguedas, Sergio Antonio, Jha, Chandra Mohan, Mallik, Debendra
Format Patent
LanguageEnglish
Published 26.10.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Embodiments may relate to a microelectronic package that includes a die coupled with a package substrate. A plurality of solder thermal interface material (STIM) thermal interconnects may be coupled with the die and an integrated heat spreader (IHS) may be coupled with the plurality of STIM thermal interconnects. A thermal underfill material may be positioned between the IHS and the die such that the thermal underfill material at least partially surrounds the plurality of STIM thermal interconnects. Other embodiments may be described or claimed.
Bibliography:Application Number: US202318346321