METHOD FOR REPLACING SOLDER BALLS OF AN ELECTRONIC PACKAGE

A method for replacement of solder balls of an electronic package soldered to seats located on a surface of the electronic package. The method comprises collectively heating the solder balls to melt the solder balls, removing each one of the solder balls from the corresponding seats by suction, prov...

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Bibliographic Details
Main Authors Read, Matthew Sean, Carmona, Marco Antonio
Format Patent
LanguageEnglish
Published 05.10.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for replacement of solder balls of an electronic package soldered to seats located on a surface of the electronic package. The method comprises collectively heating the solder balls to melt the solder balls, removing each one of the solder balls from the corresponding seats by suction, providing a plurality of replacement solder balls, for each seat, positioning a corresponding one of the replacement solder balls on the respective seat to form an array of seated replacement solder balls, and collectively heating the array of seated replacement solder balls such that the replacement solder balls reflow and form metallurgical bonds with the seats. A system for replacing solder balls of an electronic package is also provided. An assembly for use in locating a plurality of solder balls onto an array of seats of an electronic package is also provided.
Bibliography:Application Number: US202318124154