PHOTONIC COMMUNICATION PLATFORM AND RELATED ARCHITECTURES, SYSTEMS AND METHODS

Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments pr...

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Main Authors Tymchenko, Mykhailo, Harris, Nicholas C, Joshi, Ajay, Baghdadi, Reza, Turner, Robert, Gould, Michael, Dorta-Quinones, Carlos, Bunandar, Darius, Turcott, Bradford, Kopa, Anthony, Gupta, Shashank
Format Patent
LanguageEnglish
Published 05.10.2023
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Summary:Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments provide photonic interposers that use photonic tiles, where each tile includes programmable photonic circuits that can be programmed based on the needs of a particular computer architecture. Some tiles are instantiations of a common template tile that are stitched together in a 1D or a 2D arrangement. Some embodiments described herein provide a programmable physical network designed to connect pairs of tiles together with photonic links.
Bibliography:Application Number: US202318190941