TECHNOLOGIES FOR TESTING LIQUID METAL ARRAY INTERCONNECT PACKAGES

• Main Authors: Meyyappan, Karumbu Nathan, Murtagian, Gregorio Roberto
• Format: Patent
• Language: English
• Published: 05.10.2023
• Subjects: MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TESTING

Technologies for testing integrated circuit components with liquid metal interconnects are disclosed. In the illustrative embodiment, a bed of nails adapter can mate with an integrated circuit component with liquid metal interconnects. The nails pierce a sealing cap layer that seals the liquid metal...