TECHNOLOGIES FOR TESTING LIQUID METAL ARRAY INTERCONNECT PACKAGES

Technologies for testing integrated circuit components with liquid metal interconnects are disclosed. In the illustrative embodiment, a bed of nails adapter can mate with an integrated circuit component with liquid metal interconnects. The nails pierce a sealing cap layer that seals the liquid metal...

Full description

Saved in:
Bibliographic Details
Main Authors Meyyappan, Karumbu Nathan, Murtagian, Gregorio Roberto
Format Patent
LanguageEnglish
Published 05.10.2023
Subjects
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
Online AccessGet full text

Cover

More Information
Summary:Technologies for testing integrated circuit components with liquid metal interconnects are disclosed. In the illustrative embodiment, a bed of nails adapter can mate with an integrated circuit component with liquid metal interconnects. The nails pierce a sealing cap layer that seals the liquid metal interconnects, electrically coupling the nails to the liquid metal interconnects. An underside of the bed of nails adapter has an array of pads that are coupled to the nails. The array of pads may be used to mate the bed of nails adapter and integrated circuit component with several land grid array sockets for testing of the integrated circuit component. As the bed of nails adapter does not need to be removed as the integrated circuit component is moved to a new land grid array socket, the number of times the sealing cap layer is pierced by nails during testing is reduced.
Bibliography:Application Number: US202217709630