PRIMER FOR POLYURETHANE ADHESIVE

A method is provided for bonding substrates having dissimilar coefficients of thermal expansion, using a thermoset adhesive. The method involves a pre-cure step using radio-frequency energy, followed by a heat-curing step.

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Bibliographic Details
Main Authors Zhu, Huide, Malvadkar, Niranjan, Clark, Thomas, Sophiea, Daniel P
Format Patent
LanguageEnglish
Published 05.10.2023
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
DYES
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
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Summary:A method is provided for bonding substrates having dissimilar coefficients of thermal expansion, using a thermoset adhesive. The method involves a pre-cure step using radio-frequency energy, followed by a heat-curing step.
Bibliography:Application Number: US202118023528