COPPER SINTERING PASTE COMPOSITION AND METHOD OF PREPARING SAME

Proposed are a copper sintering paste composition and a method of preparing the same. The copper sintering paste composition can replace conventional bonding material such as solder and lead-free solder and has excellent heat resistance, heat-generating properties, thermal conductivity, and bonding...

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Bibliographic Details
Main Authors Moon, Jong Tae, Jung, Kwang Mo
Format Patent
LanguageEnglish
Published 05.10.2023
Subjects
CASTING
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
POWDER METALLURGY
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
WORKING METALLIC POWDER
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Summary:Proposed are a copper sintering paste composition and a method of preparing the same. The copper sintering paste composition can replace conventional bonding material such as solder and lead-free solder and has excellent heat resistance, heat-generating properties, thermal conductivity, and bonding strength.
Bibliography:Application Number: US202318129163