MULTI-DIMENSIONAL COLUMN-BASED HEAT DISSIPATION FEATURES FOR DATACENTER COOLING SYSTEMS

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a number of multi-dimensional column-based heat dissipation features enable cooling by a cooling media flowing there through so that an individual heat dissipation column having a first dimension and a second dim...

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Bibliographic Details
Main Authors Narasimhan, Susheela Nanjunda Rao, Choudhry, Sanjay, Hennigh, Oliver, Tangsali, Kaustubh Mahesh, Nabian, Mohammad Amin
Format Patent
LanguageEnglish
Published 28.09.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a number of multi-dimensional column-based heat dissipation features enable cooling by a cooling media flowing there through so that an individual heat dissipation column having a first dimension and a second dimension may be supported, with the first dimension being normal relative to an axial flow path of the cooling media, with the second dimension being parallel or offset from parallel relative to the axial flow path and with the second dimension being more than the first dimension.
Bibliography:Application Number: US202217704678