FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELECTRONIC SYSTEMS

An apparatus is described that includes a flow enhancement structure to enhance a flow of immersion bath liquid specifically through space between fins of a heat sink and/or across a base of a heat sink.

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Bibliographic Details
Main Authors KIM, Sung Ki, MCAFEE, Eric D, GONG, Haifeng, AHUJA, Sandeep, ZHOU, Shaorong, ZHANG, Guangying, DAMM, Drew, DU, Liguang, MACDONALD, Mark, GULLBRAND, Jessica, SARANGI, Suchismita, PIDWERBECKI, David, WANG, Chuanlou, QUE, Xiang
Format Patent
LanguageEnglish
Published 28.09.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:An apparatus is described that includes a flow enhancement structure to enhance a flow of immersion bath liquid specifically through space between fins of a heat sink and/or across a base of a heat sink.
Bibliography:Application Number: US202318203904