MODULE CONFIGURATIONS FOR INTEGRATED III-NITRIDE DEVICES
An electronic module for a half-bridge circuit includes a base substrate with an insulating layer between a first metal layer and a second metal layer. A trench formed through the first metal layer electrically isolates first, second, and third portions of the first metal layer from one another. A h...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
28.09.2023
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Subjects | |
Online Access | Get full text |
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