INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING MAGNETIC MATERIAL

An integrated device that includes a die substrate comprising a plurality of transistors, an interconnection portion coupled to the die substrate, and a packaging portion coupled to the interconnection portion. The interconnection portion includes at least one die dielectric layer and a plurality of...

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Bibliographic Details
Main Authors LIU, Kai, KIM, Jonghae, LAN, Je-Hsiung
Format Patent
LanguageEnglish
Published 28.09.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated device that includes a die substrate comprising a plurality of transistors, an interconnection portion coupled to the die substrate, and a packaging portion coupled to the interconnection portion. The interconnection portion includes at least one die dielectric layer and a plurality of die interconnects coupled to the plurality of transistors. The packaging portion includes at least one magnetic layer and a plurality of metallization interconnects coupled to the plurality of die interconnects.
Bibliography:Application Number: US202217705041