PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME

• Main Authors: Lin, Chia-Hsiang, Lin, Chi-Pu, Yu, Chien-Tung, Jeng, Shin-Puu
• Format: Patent
• Language: English
• Published: 28.09.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method includes forming a redistribution structure, wherein forming the redistribution structure includes forming a first conductive material on a portion of a first seed layer, forming a mask over the first seed layer and the first conductive material, wherein an opening in the mask at least partially exposes the first conductive material, forming a first conductive via in the opening, etching portions of the first seed layer using the first conductive material as an etching mask, depositing a first insulating layer over the first conductive via, the first conductive material and remaining portions of the first seed layer, and etching the first insulating layer such that a portion of the first conductive via protrudes above a top surface of the first insulating layer, and attaching a first die to the redistribution structure using first electrical connectors.