PASSIVATION LAYER FOR INTEGRATED CIRCUIT STRUCTURE AND FORMING THE SAME

An integrated circuit (IC) structure includes a substrate, an interconnect structure, metal lines, a liner, a protecting layer, and a nitride-free passivation layer. The interconnect structure is over the substrate. The metal lines are over the interconnect structure. The liner is conformally formed...

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Bibliographic Details
Main Authors CHEN, Chun-Chiang, SU, Ching-Hou, WANG, Chih-Pin, WU, Chun-Ting
Format Patent
LanguageEnglish
Published 28.09.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated circuit (IC) structure includes a substrate, an interconnect structure, metal lines, a liner, a protecting layer, and a nitride-free passivation layer. The interconnect structure is over the substrate. The metal lines are over the interconnect structure. The liner is conformally formed on the metal lines. The protecting layer is over the liner. The nitride-free passivation layer continuously extends from the liner to the protecting layer and forms an interface with the liner.
Bibliography:Application Number: US202318317759