SILVER PATTERNING AND INTERCONNECT PROCESSES
A method for forming a semiconductor structure is provided. The method includes depositing a hard mask layer over a substrate. The method further includes depositing a silver precursor layer over the hard mask layer. The method further includes exposing portions of the silver precursor layer to a ra...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
28.09.2023
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Subjects | |
Online Access | Get full text |
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Summary: | A method for forming a semiconductor structure is provided. The method includes depositing a hard mask layer over a substrate. The method further includes depositing a silver precursor layer over the hard mask layer. The method further includes exposing portions of the silver precursor layer to a radiation, the radiation causing a reduction of silver ions in the irradiated portions of the silver precursor layer. The method further includes removing non-irradiated portions of the silver precursor layer, resulting in a plurality of silver seed structures. |
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Bibliography: | Application Number: US202318327785 |