SUBSTRATE PROCESSING APPARATUS

A substrate processing apparatus delivers a gas between a lower surface of a substrate and a base surface of a base part to form an airflow flowing radially outward and to cause a pressure drop in a space between the substrate and the base part by the Bernoulli effect. The base surface includes a se...

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Bibliographic Details
Main Authors KABA, Hiromichi, NAKAZAWA, Kazuhiko, OTA, Takashi, MORIOKA, Toshihito
Format Patent
LanguageEnglish
Published 28.09.2023
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Summary:A substrate processing apparatus delivers a gas between a lower surface of a substrate and a base surface of a base part to form an airflow flowing radially outward and to cause a pressure drop in a space between the substrate and the base part by the Bernoulli effect. The base surface includes a second surface sloping upward in a radially outward direction. A third surface slopes downward in a radially outward direction from the outer peripheral edge of the second surface. A fourth surface is an annular surface contiguous to the lower edge of the third surface. The fourth surface expands radially outward outside the outer peripheral edge of the substrate in the radial direction. Accordingly, it is possible to suppress adhesion of a processing liquid to the lower surface of the substrate and to improve the stability of holding the substrate.
Bibliography:Application Number: US202318188976