PROGRAMMABLE INTERPOSER USING RRAM PLATFORM

• Main Authors: TAN, Juan Boon, LIN, Benfu, LEONG, Lup San, JIANG, Yi
• Format: Patent
• Language: English
• Published: 21.09.2023

According to various embodiments, there may be provided an interposer. The interposer including: a substrate; a dielectric layer disposed on the substrate; a via disposed entirely within the dielectric layer; a resistive film layer disposed to line the via; a metal interconnect disposed in the resistive layer lined via; and a plurality of metal lines disposed in the dielectric layer, the plurality of metal lines including a first metal line connected to the metal interconnect, a second metal line connected to the resistive film layer at a first point, and a third metal line connected to the resistive film layer at a second point.