MICROELECTRONIC STRUCTURE INCLUDING ACTIVE BASE SUBSTRATE WITH THROUGH VIAS BETWEEN A TOP DIE AND A BOTTOM DIE SUPPORTED ON AN INTERPOSER

• Main Authors: Deshpande, Nitin A, Bhatia, Mohit, Mallik, Debendra, Karhade, Omkar G
• Format: Patent
• Language: English
• Published: 21.09.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A microelectronic component and a method of forming same. The microelectronic component includes: a first substrate having first through vias therein, the first substrate including silicon or glass; a first layer on a front surface of the first substrate and including one or more first dies coupled to the first through vias; a second substrate on a front surface of first layer and having second through vias therein and including silicon or glass; a second layer on a front surface of the second substrate, the first layer between the first substrate and the second substrate, the second layer including one or more second dies coupled to the second through vias; and electrically conductive structures on a back surface of the first substrate coupled to the first through vias.