COOLING APPARATUS, SEMICONDUCTOR DEVICE INCLUDING THE APPARATUS, AND MANUFACTURING METHOD THEROF

A cooling apparatus may include a microchannel structure including a plurality of microchannels and a manifold disposed over the plurality of microchannels. The microchannel structure may be directly bonded to a chip and dissipate heat generated in the chip during an operation of the chip. The micro...

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Bibliographic Details
Main Authors CHOO, Kyo Sung, PARK, Yeong Lyeol
Format Patent
LanguageEnglish
Published 21.09.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A cooling apparatus may include a microchannel structure including a plurality of microchannels and a manifold disposed over the plurality of microchannels. The microchannel structure may be directly bonded to a chip and dissipate heat generated in the chip during an operation of the chip. The microchannel structure may further include a base over which the plurality of microchannels are disposed and a plurality of fins spaced apart from each other and disposed over the base.
Bibliography:Application Number: US202318184500