COMBINED SELF-FORMING BARRIER AND SEED LAYER BY ATOMIC LAYER DEPOSITION
An electrically conductive structure in an integrated circuit (IC) includes recessed features in a dielectric layer filled with metal. The recessed features include a conformal, self-forming diffusion barrier and seed layer to limit oxidation of the metal into ions that will diffuse through the diel...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
21.09.2023
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Subjects | |
Online Access | Get full text |
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